Microwave and Millimeter-Wave Electronic Packaging

Microwave and Millimeter-Wave Electronic Packaging

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Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.In another method, used for quick prototyping, the undesired material is removed using a computer numerically controlled (CNC) milling machine. In this approach, the boards are mounted on a CNC machine using a vacuum plate. The boardsanbsp;...

Title:Microwave and Millimeter-Wave Electronic Packaging
Author: Rick Sturdivant
Publisher:Artech House - 2013-12-01

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